Our Services

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Our company provides the entire specific design flow to customers. 

We will do our best to speed up product tape out for fast market entry.

We assist Asian companies in a wide range of technology nodes with digital and mixed-signal designs, high voltage, and ultra-low power consumption solutions.

We perform:

·  SoC Design / RISC V-based SoC architecture designs 

·  RTL Integration & IP subsystem development 

·  Full-Chip / SoC Level Design with Verilog/VHDL 

·  Migration from FPGA to ASIC 

·  Integration of digital and analog blocks (Like SERDES PMA + PCS or DDR + Phy etc.,) 

·  Synthesis for ASIC and FPGA 

·  DRC, LVS, and formality checks 

·  Optimization of Power, Area, and timing tradeoffs 

·  FPGA Prototyping 

Our company works only with reliable and trusted IP vendors and IP suppliers. 

We will assist your project and help you to make a choice, recommending the most suitable IP. 

Besides that, all paperwork will be done on our side.

Our company provides tape out service at the most important Asian silicon fabs. 

We can offer MPW tape out for prototyping and testing of your IC or IP design and mask set tape out for mass production. 

Also, assembly service in various package types by using high quality and well-known assembly houses facilities can be provided as well.

Our team works with high-quality and well-known assembly houses, we know their possibilities and can suggest which fab meets your project requirements the best. 

We have experience in supporting the following package types: BGA, fcBGA, QFN, QFP, TSSOP, SOIC, WLCSP, and SiP. 

Also, our customers prefer flip-chip, die stacked, and TSV technologies.